• Skip to main content
  • Skip to secondary menu
  • Skip to footer

Technologies.org

Technology Trends: Follow the Money

  • Technology Events 2026-2027
  • Sponsored Post
  • Technology Markets
  • About
    • GDPR
  • Contact

Nassim Nicholas Taleb Honored for Exploring Methods of Decision-Making in Complex Situations

October 29, 2018 By admin Leave a Comment

NYU Tandon Distinguished Professor of Risk Engineering Garners Award from Wolfram Research

Nassim Nicholas Taleb, Distinguished Professor of Risk Engineering at the NYU Tandon School of Engineering, recently became a recipient of a Wolfram Innovator Award. The prize was given at the 2018 Wolfram Technology Conference in Champaign, Illinois, held in mid-October.

The Innovator Awards are given to those who play a major role in pushing the boundaries of how Wolfram technology can be leveraged for innovation across fields and disciplines. Taleb was honored for his use of Mathematica, an integrated software platform that covers the breadth and depth of technical computing. In its decision, the company cited his “contributions to decision making under complicated and less-idealized probabilistic structures.” Probabilistic structures provide a useful method of approximating data points in large data sets. Wolfram also cited Incerto, his 4-volume essay on uncertainty (Antifragile, The Black Swan, Fooled by Randomness, The Bed of Procrustes), in which he explored computational preasymptotics, a field that is often ignored.

“We are honored to count Professor Taleb as a member of Tandon’s Department of Finance and Risk Engineering and grateful that our students receive the benefit of his deep experience and thought leadership,” said Department Chair Peter Carr. “This latest honor from Wolfram is confirmation of the esteem in which he is held and his importance to the fields of global finance and risk.”

About the New York University Tandon School of Engineering
The NYU Tandon School of Engineering dates to 1854, the founding date for both the New York University School of Civil Engineering and Architecture and the Brooklyn Collegiate and Polytechnic Institute (widely known as Brooklyn Poly). A January 2014 merger created a comprehensive school of education and research in engineering and applied sciences, rooted in a tradition of invention and entrepreneurship and dedicated to furthering technology in service to society. In addition to its main location in Brooklyn, NYU Tandon collaborates with other schools within NYU, one of the country’s foremost private research universities, and is closely connected to engineering programs at NYU Abu Dhabi and NYU Shanghai. It operates Future Labs focused on start-up businesses in downtown Manhattan and Brooklyn and an award-winning online graduate program. For more information, visit http://engineering.nyu.edu.

www.facebook.com/nyutandon
@NYUTandon

SOURCE NYU Tandon School of Engineering

Related Links
http://www.poly.edu

Filed Under: Tech

Reader Interactions

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Footer

Recent Posts

  • Apple iPhone 17e: Performance, Practicality, and a Smarter Entry Point into the iPhone 17 Family
  • Apple iPad Air M4 Arrives With 12GB Memory, Wi-Fi 7, and a Serious AI Push
  • Ericsson and Intel Are Redefining What 6G Is Actually For
  • Hollow-Core Fibre, Light Running Through Air Instead of Glass
  • Revel Raises $150M to Modernize the Software Backbone of Mission-Critical Hardware
  • Samsung Galaxy S26 Series: Polished, Predictable, and Playing It Safe
  • SambaNova Unveils SN50 AI Chip, Secures $350M+ Funding, and Strikes Strategic Intel Partnership
  • Aalyria Raises $100M Series B to Build the Control Plane for the Space Internet
  • Faraday Future’s Quiet Reset: Robots First, Cars Follow, Cash Matters Now
  • Pepper Raises $50 Million Series C to Modernize Independent Food Distribution

Media Partners

  • Market Analysis
  • Cybersecurity Market
Memory Crunch: Why Prices Are Surging and Why Making More Memory Isn’t Easy
The End of Accounting as We Knew It
The Era of Superhuman Logistics Has Arrived: Building the First Autonomous Freight Network
Why Nvidia Shares Jumped on Meta, and Why the Market Cared
Accrual Launches With $75M to Push AI-Native Automation Into Core Accounting Workflows
Europe’s Digital Sovereignty Moment, or How Regulation Became a Competitive Handicap
Palantir Q4 2025: From Earnings Beat to Model Re-Rating
Baseten Raises $300M to Dominate the Inference Layer of AI, Valued at $5B
Nvidia’s China Problem Is Self-Inflicted, and Washington Should Stop Pretending Otherwise
USPS and the Theater of Control: How Government Freezes Failure in Place
Fal.Con Gov 2026, March 18, Washington, D.C.
Huper Corporation Raises $1.5M Pre-Seed to Build a Security-First AI Chief of Staff
CyberBay Summit 2026, March 11–13, Tampa, Florida
Zscaler’s Q2 Beat and the Market’s Reluctance to Celebrate
AI as the New Insider: Why Trust, Not Code, Is Now the Weakest Link
Cybersecurity Meets Corporate Travel: Darktrace Chooses AI-Driven Navan to Power Global Mobility
Black Hat Asia 2026, April 21–24, Singapore
Billington State and Local CyberSecurity Summit, March 9–11, 2026, Washington, D.C.
The Future of Incident Management: A Blueprint for Operational Excellence, March 17, 2026, London
Gartner Identity & Access Management Summit, 9 – 10 March 2026, London, U.K.

Media Partners

  • Market Research Media
  • Technology Conferences
Why Attraction-Grabbing Stations Win at Tech Events
Why Nvidia Let Go of Arm, and Why It Matters Now
When the Market Wants a Story, Not Numbers: Rethinking AMD’s Q4 Selloff
BBC and the Gaza War: How Disproportionate Attention Reshapes Reality
Parallel Museums: Why the Future of Art Might Be Copies, Not Originals
ClickHouse Series D, The $400M Bet That Data Infrastructure, Not Models, Will Decide the AI Era
AI Productivity Paradox: When Speed Eats Its Own Gain
Voice AI as Infrastructure: How Deepgram Signals a New Media Market Segment
Spangle AI and the Agentic Commerce Stack: When Discovery and Conversion Converge Into One Layer
PlayStation and the Quiet Power Center of a $200 Billion Gaming Industry
Mobile World Congress (MWC) 2026 – 2–5 March, Barcelona, Spain
The AI Summit London, 10–11 June 2026, Tobacco Dock, London
aim10x Digital 2026, March 18, Virtual
Harvard Business Review Strategy Summit, February 26, 2026, Virtual
International Compact Modeling Conference, July 30–31, 2026, Long Beach, California
Israel Tech Week Miami (ISRTW), April 27–30, 2026, Miami, Florida
Data Centre World London, 4–5 March 2026, ExCeL London
Hannover Messe: Trade Fair for the Manufacturing Industry, 20–24 April 2026, Hannover, Germany
DesignCon 2026, Feb. 24–26, Santa Clara Convention Center
NICT at Mobile World Congress 2026, March 2–5, Barcelona

Copyright © 2022 Technologies.org

Media Partners: Market Analysis & Market Research and Exclusive Domains, Photography