Silicon Box, a semiconductor startup headquartered in Singapore, has successfully raised $220 million in funding to bolster its manufacturing capabilities and facilitate global expansion. The company specializes in cutting-edge packaging for chiplets, which are modular chips featuring interchangeable components that offer enhanced flexibility and performance. Silicon Box’s exclusive sub-5-micron technology is designed to optimize power efficiency and significantly reduce manufacturing expenses. Under the leadership of CEO Han Lei, the startup operates in Singapore, a strategically advantageous location with robust government backing for the semiconductor sector. Silicon Box’s chiplets are utilized across various industries, including AI, high-performance computing, mobile computing, data centers, and electric vehicles. This funding will drive further innovation in semiconductor technology and solidify Silicon Box’s position in the market, particularly as chiplet-based designs continue to gain momentum.
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