Tech

Revolutionary Future-Proof Design Disrupts AI Space by Running Multiple Workloads Simultaneously and is Faster Than Any Chip on the Market As traditional chip makers struggle to embrace the challenges presented by the rapidly evolving AI software landscape, a San Jose startup has announced it has working silicon and a whole new future-proof chip paradigm to address these … [Read more...] about SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip

SaberEXP Delivers Fastest Convergence for Early Power Component Design and Seamless Export to High-Fidelity System Validation Highlights: Power electronics component and system complexity is growing rapidly driven by electrification of automotive, aerospace and industrial systems Virtual prototyping enables design teams to start development early and validate their designs … [Read more...] about Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution

JinkoSolar Holding Co., Ltd. (the "Company," or "JinkoSolar") (NYSE: JKS), one of the largest and most innovative solar module manufacturers in the world, today announced that it has signed a Module Supply Agreement for the Kozani project ("Kozani") in the north of Greece, which has been developed by juwi Hellas Renewable Energy Sources S.A. ("juwi Hellas"). Construction of the … [Read more...] about JinkoSolar to Supply 204 MW of Swan Bifacial Modules to juwi Hellas for the Biggest Bifacial Solar Project Ever Built in Europe

Canon announced today the launch in Japan of the LI8020SAC (color) and LI8020SAM (monochrome), two new APS-H size (approximately 29.4 mm x 18.9 mm) CMOS sensors capable of image capture with a resolution of approximately 250 megapixels (19,568 x 12,588 pixels). The new CMOS sensors achieve an ultra-high resolution of approximately 250 megapixels, enabling the image capture of … [Read more...] about Canon Announces the 250-megapixel Ultra-high Resolution LI8020SAC and LI8020SAM CMOS Sensors

SK hynix will pay US $9 billion for the Intel NAND memory and storage business, which includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. SK hynix aims to enhance the competitiveness of its NAND flash solutions as one of the leading global semiconductor companies and grow the memory ecosystem to the … [Read more...] about SK hynix to Acquire Intel NAND Memory Business

Espoo, Finland – Nokia and Google Cloud today announced a five-year strategic collaboration that will see Nokia migrate its on-premise IT infrastructure onto Google Cloud. Nokia will migrate its data centers and servers around the world, as well as various software applications, onto Google Cloud infrastructure. The deal reflects Nokia’s important operational shift to a … [Read more...] about Nokia and Google Cloud sign strategic collaboration to transform Nokia’s digital infrastructure

Enapter, the leader in breakthrough AEM electrolysis technology, has announced plans to build its first mass-production facility in North Rhine-Westphalia, Germany. The 'Enapter Campus' will be built in the climate community of Saerbeck, including both a production centre and extensive R&D facilities that will enable scaled-up manufacturing of their modular systems for green … [Read more...] about Enapter Chooses Germany for Electrolyser Mass-Production Site

EDF upgrades its nuclear output estimate in France for 2020 EDF upgrades its nuclear output estimate in France for 2020 In light of the current progress of the maintenance schedule, the EDF Group upgrades its nuclear output estimate in France for 2020, to around 325-335 TWh. This press release is certified. Its authenticity can be checked on medias.edf.com A key player in … [Read more...] about The EDF Group upgrades its nuclear output estimate in France for 2020, to around 325-335 TWh

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD403-1 JEDEC Module Sideband Bus standard (“SidebandBus”). SidebandBus was developed in coordination with the MIPI® Alliance as both a subset and superset of the MIPI I3C BasicSM serial bus standard. SidebandBus defines … [Read more...] about JEDEC Announces Publication of JEDEC Module Sideband Bus

The U.S. Department of Energy (DOE) today announced it has selected two U.S.-based teams to receive $160 million in initial funding under the new Advanced Reactor Demonstration Program (ARDP). ARDP, announced in May, is designed to help domestic private industry demonstrate advanced nuclear reactors in the United States. DOE is awarding TerraPower LLC (Bellevue, WA) and … [Read more...] about U.S. Department of Energy Announces $160 Million in First Awards under Advanced Reactor Demonstration Program