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Liquid Cooling for HPC System

November 7, 2017 By admin Leave a Comment

Asetek (ASETEK.OL) and Cybermedia Center, Osaka University, today announced that Cybermedia Center, Osaka University will incorporate Asetek RackCDU Direct-to-Chip™ (D2C) liquid cooling for a new HPC (High Performance Computing) installation in Japan. The OCTOPUS (Osaka university Cybermedia cenTer’s Over-Petascale Universal Supercomputer) HPC cluster is a part of Osaka University’s expansion of computing power to support world leading basic and applied research.

“With the latest high-performance CPUs and GPUs, liquid cooling technology is becoming a requirement for maintaining un-throttled compute throughput for supercomputers. For Osaka University, maximum computational performance with high density is vital and so proven and reliable liquid cooling was essential,” said Dr. Susumu Date, Associate Professor of the Cybermedia Center, Osaka University.

OCTOPUS will initially include liquid cooling for 236 nodes of Skylake compute servers, 44 nodes of Xeon Phi (KNL) MIC-GPU servers and 37 Pascal (P100) GPU nodes. The system will also incorporate Asetek’s latest InRackCDU technology for the transfer of heat captured in the server nodes into facilities water for rejection. Use of InRackCDU does not require additional floor space when implementing advanced liquid cooling on HPC racks.

Asetek RackCDU D2C is a hot water liquid cooling solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data center server density.

Related market reports:
Quantum Computing Market Forecast
Worldwide Defense High Performance Computing (HPC) Market Forecast
Worldwide High Performance Computing (HPC) Market Forecast
Hybrid Quantum-HPC Market Forecast

Filed Under: Tech Tagged With: HPC System, Liquid Cooling

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