• Skip to main content
  • Skip to secondary menu
  • Skip to footer

Technologies.org

Technology Trends: Follow the Money

  • Technology Events 2026-2027
  • Sponsored Post
  • Technology Markets
  • About
    • GDPR
  • Contact

CES 2019: Toshiba Memory America Points to the Future of Technology Fueled by BiCS FLASH 3D Flash Memory

January 7, 2019 By admin Leave a Comment

This week at CES® 2019, Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, will be on hand to highlight its BiCS FLASH™ 3D technology – and the role it plays in the company’s latest flash memory, UFS, solid state drive (SSD), and KumoScale™ software products. TMA will also leverage CES as a stage to debut the fourth generation of its single-package ball grid array (BGA) SSD product line: the BG4 series.

Making its public debut at CES, TMA’s BG4 series – a new lineup of ultra-compact, single-package NVMe™ SSDs – places both the flash and controller in one package, bringing flexibility to the design of ultra-thin notebooks, embedded systems and boot storage applications for servers and data centers. The BG4 series leverages TMA’s innovative 96-layer BiCS FLASH.

“Although we have been recognized as the inventor of flash memory and the first to introduce the concept of 3D flash memory, we are not content to simply rest on our laurels,” noted Scott Nelson, senior vice president and general manager of Toshiba Memory America, Inc.’s Memory Business Unit. “We continue to refine and push the technology forward in order to address data storage challenges. This approach has made us one of the world’s largest flash memory suppliers and has enabled us to lead the way forward in the migration from floating gate to 3D and 96-layer BiCS FLASH QLC (quadruple-level-cell). We are also helping to chart the path forward in areas such as virtual reality, automotive infotainment, artificial intelligence, technology, and more.”

Demonstrations are located in Toshiba Memory America’s private demo suite at The Venetian® Resort (Toscana 3704) from January 8 – 11, and include:

BG4 series of ultra-compact, single-package NVMe SSDs
Enterprise, Client and Data Center SSDs
KumoScale™ software
Qualcomm® Snapdragon™ 845 Mobile Development Platform with Toshiba UFS
Qualcomm Snapdragon 820A Automotive Development Platform with Toshiba UFS
For more information, please visit business.toshiba-memory.com

About Toshiba Memory America, Inc.
Toshiba Memory America, Inc. is the U.S.-based subsidiary of Toshiba Memory Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough 96-layer BiCS FLASH™ 3D technology, Toshiba continues to lead innovation and move the industry forward. For more information on Toshiba Memory, please visit business.toshiba-memory.com.

Filed Under: Tech

Reader Interactions

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Footer

Recent Posts

  • Quantum Motion Raises $160 Million Series C to Scale Silicon-Based Quantum Computing
  • Fazeshift Raises $17 Million Series A to Automate Accounts Receivable With Autonomous AI Agents
  • Instant Power Becomes the Next AI Infrastructure Battleground as Nyobolt Raises $60 Million
  • NVIDIA and Corning Expand U.S. Optical Manufacturing for AI Infrastructure
  • QuantWare Raises $178 Million Series B, Announces 10,000-Qubit Processor Architecture
  • Panthalassa Raises $140 Million to Power AI Computing with Ocean Waves
  • JEDEC Advances DDR5 MRDIMM Architecture With New MDB Standard and Next-Gen Memory Roadmap
  • Hydrogen Embrittlement and Pipeline Infrastructure: The Metal Problem No One Wants to Talk About
  • Hydrogen Policy in the United States: Decades of Investment, Uncertain Direction
  • Hydrogen and Grid Resilience: The Long-Duration Storage Problem

Media Partners

  • Market Analysis
  • Cybersecurity Market
  • App Coding
Why Memory Prices Won’t Come Down
The Bill Comes Due
The Software-Defined Camera Won. The Open OS Did Not.
Cars Are Computers Now, and Most Carmakers Aren’t
Gartner: Global IT Spending to Hit $6.31 Trillion in 2026, Driven by AI Infrastructure
The SDK Generator Benchmarks: Infrastructure vs. Convenience
Infographic: We Are Likely in the Early Stages of Another Productivity Boom
Infographic: Establishing the National Multimodal Freight Network
Global WiFi Market: Size, Segmentation, Trends, and Forecast to 2030
Synera’s $40M Series B: What the Press Release Isn’t Saying
ShinyHunters Breaches Canvas LMS, Threatening Data on 275 Million Users
NETSCOUT FY2026: Revenue Growth, Margin Expansion, and a Balance Sheet That Tells the Real Story
Day Zero Threat Research Summit, August 30–September 1, 2026, Las Vegas
AI Agent Security Summit, May 27, 2026, San Francisco
General Analysis Raises $10 Million to Secure the Fast-Rising World of AI Agents
Black Hat Asia 2026, Singapore: Cybersecurity Event Highlights AI Threats and Data Sovereignty
Aptori Expands Runtime-Driven Validation Platform for the AI Coding Era
Rilian Raises $17.5 Million to Bring Agentic AI Into Cybersecurity and Sovereign Defense
ServiceNow Completes $7.75 Billion Armis Acquisition, Expands AI Security Ambitions
Enterprise WiFi Security: Where Convenience Stops and Control Begins
DigitalOcean Launches AI-Native Cloud at Deploy 2026
Verdent Updates AI Platform to Function as a Full Engineering Team for Solo Builders
The Side Project App Is Not Dead. The Side Project App Business Is.
The App Monetization Landscape Has Changed and Most Teams Have Not Caught Up
Building Offline-First Mobile Apps Is Harder Than It Looks and Worth It
State Management in React Native Has Too Many Options and One Right Answer
Mobile Accessibility Is the Case Developers Keep Ignoring
Testing Mobile Apps at Scale Without Losing Your Mind
App Store Optimization in 2026 Is a Different Game Than It Was
Cross-Platform vs Native: The Honest Assessment Nobody Gives You

Media Partners

  • Market Research Media
  • Technology Conferences
  • API Coding
China’s U.S. Treasury Holdings: The Great Repositioning (2021–2025)
Infographic: Why the 2025 CIPA Data Proves the APS-C Renaissance is Real
How WiFi Changed Media
Canva Acquires Simtheory and Ortto to Build End-to-End Work Platform
Netflix Price Hikes, The Economics of Dominance in a Saturated Streaming Market
America’s Brands Keep Winning Even as America Itself Slips
Kioxia’s Storage Gambit: Flash Steps Into the AI Memory Hierarchy
Mamdani Strangling New York
The Rise of Faceless Creators: Picsart Launches Persona and Storyline for AI Character-Driven Content
Apple TV Arrives on The Roku Channel, Expanding the Streaming Platform Wars
Technology Investor Conference Circuit, May–June 2026
Automate 2026 Sets Its Agenda Around AI’s Role in Industrial Transformation, June 22–25, 2026, McCormick Place in Chicago
IBM Think 2026, May 5–8, Boston, Massachusetts, USA
AI & Creativity Summit New York 2026, May 14, The Lighthouse Brooklyn
SEMICON Southeast Asia 2026, May 5–7, Kuala Lumpur
SID Display Week 2026, May 3–8, Los Angeles Convention Center
Big Dipper Innovation Summit, May 12–14, 2026, Richmond
RISC-V Summit Europe 2026, June 8–12, Bologna, Italy
Data Center World 2027, May 24–27 2027, Music City Center, Nashville, Tennessee
Snowflake Summit 26, June 1–4, 2026, San Francisco
Why Private Domain Data Is the Real Key to AI That Actually Works
Orkes Raises $60M to Bring Production-Grade AI Orchestration to Enterprise Developers
Form.io Launches MCP Server and Agentic Coding Toolset for Governed Enterprise AI Development
Appdome Upgrades MobileBOT Defense With Identity-First Mobile API Protection
Five SDK Generators Compared: Speakeasy, Stainless, Fern, APIMatic, and OpenAPI Generator
API Monetization Models That Work and the Ones That Drive Developers Away
gRPC in Production: What the Documentation Doesn't Tell You
Event-Driven Architecture vs Request-Response: Choosing the Right Communication Pattern
The Business Case for Internal APIs That Most Engineering Leaders Ignore
Breaking Changes: How to Avoid Shipping Them and What to Do When You Must

Copyright © 2026 Technologies.org

Media Partners: Market Analysis · Market Research · Referently · Photography