• Skip to main content
  • Skip to secondary menu
  • Skip to footer

Technologies.org

Technology Trends: Follow the Money

  • Technology Events 2026-2027
  • Sponsored Post
  • Technology Markets
  • About
    • GDPR
  • Contact

JEDEC Announces Publication of JEDEC Module Sideband Bus

October 13, 2020 By admin Leave a Comment

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD403-1 JEDEC Module Sideband Bus standard (“SidebandBus”). SidebandBus was developed in coordination with the MIPI® Alliance as both a subset and superset of the MIPI I3C BasicSM serial bus standard. SidebandBus defines the parameters for usage of the system management control bus for the coming generation of DDR5 memory modules and beyond, and is available for download from the JEDEC website.

SidebandBus defines the system aspects of JEDEC’s application of the MIPI I3C Basic protocol and electrical characteristics. SidebandBus enhances I3C Basic with extended commands and functions such as a hub functionality that increases the number of supported devices on the bus without sacrificing the full 12.5 MHz throughput of the bus. SidebandBus also supports a smooth migration from legacy systems to the new interface by supporting operation in a slower I2C mode, allowing the industry time to transition.

SidebandBus was developed in parallel with and is incorporated into a family of new support devices focused on DDR5 including Power Management IC (PMICs), Thermal Sensors, Registering Clock Drivers (RCD), and the recently released Serial Presence Detect (SPD) device which acts as the SidebandBus hub for the other devices.

“SidebandBus represents a significant growth of JEDEC’s efforts to coordinate a wide variety of functions to enable the system level factors to enable the next generation of high-performance memories,” said Bill Gervasi, Chairman of the SPD Task Group that developed the SidebandBus standard. “The high-performance communications enabled by this system management bus allow systems to efficiently configure the new memory modules and collect telemetry data in real time to monitor system health on the fly.”

“MIPI Alliance has a well-established relationship with JEDEC that has continued to advance the industries we serve through the development of complementary specifications,” said Peter Lefkin, MIPI Alliance Managing Director. “MIPI I3C, along with its subset, I3C Basic, has been widely embraced as the next-generation bus interface, and we’re pleased to support its use in JEDEC’s new SidebandBus standard.”

“JEDEC is delighted to continue our longstanding collaboration with MIPI Alliance on the development of I3C Basic and SidebandBus, which have helped the industry converge on a unified strategy for serial buses for the next generation of networked electronic devices,” added Mian Quddus, JEDEC Board of Directors Chairman.

About JEDEC
JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 300 member companies work together over 100 JEDEC technical committees and task groups to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit www.jedec.org.

Filed Under: Tech

Reader Interactions

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Footer

Recent Posts

  • Dify Raises $30 Million to Power the Next Wave of Production AI Applications
  • Nscale’s $2 Billion Bet on the Physical Backbone of the AI Economy
  • Why USB-C Charging on the MacBook Neo Raises Questions About Port Durability
  • MagSafe Wireless Charging: The Magnetic Reinvention of Power
  • Apple Unveils MacBook Neo: A $599 Entry Into the Mac Ecosystem
  • Apple Unveils M5 Pro and M5 Max: A New Era for MacBook Pro, MacBook Air, and Studio Display
  • Apple iPhone 17e: Performance, Practicality, and a Smarter Entry Point into the iPhone 17 Family
  • Apple iPad Air M4 Arrives With 12GB Memory, Wi-Fi 7, and a Serious AI Push
  • Ericsson and Intel Are Redefining What 6G Is Actually For
  • Hollow-Core Fibre, Light Running Through Air Instead of Glass

Media Partners

  • Market Analysis
  • Cybersecurity Market
Zohran Mamdani’s Politics of Confiscation
Beyond Shipyards: Stephen Carmel’s Maritime Warning and the Hard Reality of Rebuilding an Oceanic System
Memory Crunch: Why Prices Are Surging and Why Making More Memory Isn’t Easy
The End of Accounting as We Knew It
The Era of Superhuman Logistics Has Arrived: Building the First Autonomous Freight Network
Why Nvidia Shares Jumped on Meta, and Why the Market Cared
Accrual Launches With $75M to Push AI-Native Automation Into Core Accounting Workflows
Europe’s Digital Sovereignty Moment, or How Regulation Became a Competitive Handicap
Palantir Q4 2025: From Earnings Beat to Model Re-Rating
Baseten Raises $300M to Dominate the Inference Layer of AI, Valued at $5B
Onyx Security Raises $40 Million to Build the Security Layer for Autonomous AI
Armadin Raises $189.9 Million to Build an AI Attacker That Defends the Enterprise
Day Zero Threat Research Summit, August 30 – September 1, 2026, Las Vegas
CrowdStrike Returns to Profit as Revenue Climbs to $1.31 Billion in Q4
Cloudflare 2026 Threat Report Signals the Automation of Cyberwar
Fal.Con Gov 2026, March 18, Washington, D.C.
Huper Corporation Raises $1.5M Pre-Seed to Build a Security-First AI Chief of Staff
CyberBay Summit 2026, March 11–13, Tampa, Florida
Zscaler’s Q2 Beat and the Market’s Reluctance to Celebrate
AI as the New Insider: Why Trust, Not Code, Is Now the Weakest Link

Media Partners

  • Market Research Media
  • Technology Conferences
Mamdani Strangling New York
The Rise of Faceless Creators: Picsart Launches Persona and Storyline for AI Character-Driven Content
Apple TV Arrives on The Roku Channel, Expanding the Streaming Platform Wars
Why Attraction-Grabbing Stations Win at Tech Events
Why Nvidia Let Go of Arm, and Why It Matters Now
When the Market Wants a Story, Not Numbers: Rethinking AMD’s Q4 Selloff
BBC and the Gaza War: How Disproportionate Attention Reshapes Reality
Parallel Museums: Why the Future of Art Might Be Copies, Not Originals
ClickHouse Series D, The $400M Bet That Data Infrastructure, Not Models, Will Decide the AI Era
AI Productivity Paradox: When Speed Eats Its Own Gain
COMPUTEX 2026, June 2–5, Taipei
360° Mobility Mega Shows 2026, April 14–17, Taipei
Forrester CX Summit Series 2026: Amsterdam, New York, San Francisco
IAMPHENOM 2026, March 10–12, Pennsylvania Convention Center, Philadelphia
Billington State and Local CyberSecurity Summit, March 9–11, 2026, Washington, D.C.
Mobile World Congress (MWC) 2026 – 2–5 March, Barcelona, Spain
The AI Summit London, 10–11 June 2026, Tobacco Dock, London
aim10x Digital 2026, March 18, Virtual
Harvard Business Review Strategy Summit, February 26, 2026, Virtual
International Compact Modeling Conference, July 30–31, 2026, Long Beach, California

Copyright © 2022 Technologies.org

Media Partners: Market Analysis & Market Research and Exclusive Domains, Photography